Atmospheric pressure plasma device *Cumulative track record of over 1,200 units introduced.

Development, manufacturing, and sales of atmospheric pressure plasma devices with a cumulative record of over 1,200 units (2021)! Atmospheric pressure plasma devices capable of generating high-density plasma.

E-Square Co., Ltd. was established in August 1999 with the aim of contributing to the global environment by applying plasma removal technology to eliminate PFCs (perfluorocarbons) emitted during IC manufacturing and other processes. In October 2001, the company began developing a surface modification treatment device utilizing atmospheric pressure plasma equipment. Experiments on resist stripping using atmospheric pressure plasma led to the development of a surface modification device widely used in LCD manufacturing processes. In August 2002, the surface treatment device was completed, which also became a turning point for entering the coating, film, and printed circuit board industries. E-Square has developed, manufactured, and sold the atmospheric pressure plasma surface treatment device 'Precise II,' which is ultra-compact, lightweight, highly reliable, and capable of generating high-density plasma, achieving cumulative sales of over 1,200 units (as of 2021). [Features] - Newly upgraded Precise series - Superior modification performance compared to competitors (high-density plasma generation) - Damage-free and particle-free - Ultra-compact and lightweight (Precise series) For more details, please contact us or download the catalog.

basic information

**Advantages of Atmospheric Pressure Plasma Surface Modification** - Ability to control the desired surface energy (contact angle) - Treatment can reach detailed areas of the active species gas (such as OH radicals) - Can be easily used as a plasma source for water-repellent, reduction treatment, etching, and CVD equipment by adding various gases - The equipment is compact (space-saving) - No post-treatment required for exhaust gases in hydrophilic treatment - No physical damage to the treated surface (downstream type) - No charge accumulation after treatment (downstream type) - No change in device performance even when treating semiconductor devices - No UV damage to the surface during treatment - No particle generation (downstream type) - Room temperature surface drying without residue - Addition of gas species allows for the incorporation of covalent molecules suitable for matrix materials - Direct adhesion technology for various films using molecular bonding