Foam Hot Melt Applicator 'Micron + FOAM'
50% reduction in adhesive consumption! A hot melt applicator that also contributes to saving electricity costs! Usable with reactive hot melt adhesives! No nitrogen required!
"Micron+ FOAM" is a hot melt applicator that reduces adhesive consumption by foaming the adhesive. By mixing dry air (no nitrogen required) with the melted hot melt adhesive in the tank, the hot melt is foamed. This foaming increases the adhesive volume, enhancing thermal insulation and vibration effects. 【Features】 ■ Potential to reduce energy consumption by approximately 60% (according to MELER in Spain) ■ Adhesive consumption reduced by up to 50% ■ Increased adhesive volume (improved contact properties) ■ Enhanced thermal insulation ■ Improved vibration effects ■ Improved thixotropic properties *For more details, please download the PDF or feel free to contact us.
basic information
【Micron Plus Technology】 ■ Electricity cost savings ■ Easy operation with a touch panel ■ Simple maintenance *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
