Plugin Platform Package
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◆Overview The plugin platform package is made of metal and glass, featuring excellent airtightness and insulation, and is used as a Dual In-Line Package (DIP) for insertion mounting on printed circuit boards. ◆Features - It can be supplied as a set with a cover (cap). - A representative overview diagram is provided below, but we also offer custom design and manufacturing, so please consult us separately. ◆Main Specifications Airtightness: 1×10^-9 Pa·m³/sec or less Insulation Resistance: 1000 MΩ or more at DC 500V between base and lead wires Finish: Ni-Ep / Ni-Elp + Au-Ep ★ For more details, please request documentation or download the catalog ★
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◆Overview The plug-in platform package is made of metal and glass, featuring excellent airtightness and insulation, and is used as a Dual In-Line Package (DIP) for insertion mounting on printed circuit boards. ◆Features - It can be supplied as a set with a cover (cap). - A representative overview diagram is provided below, but we also offer custom design and manufacturing, so please consult us separately. ◆Main Specifications Airtightness: 1×10^-9 Pa·m³/sec or less Insulation Resistance: 1000 MΩ or more at DC 500V between base and lead wires Finish: Ni-Ep / Ni-Elp + Au-Ep ★ For more details, please request materials or download the catalog ★
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Fuji Denka is challenging itself with infinite technologies using glass and metal. In the fields of electronics, nanotechnology, and biotechnology that are paving the way for the 21st century, <FUJI-DENKA> contributes to the advancement of cutting-edge research areas. By integrating diverse technologies, we are boldly taking on new business ventures that nurture the next era and are committed to creative activities.