High heat release header
High heat release header
**Overview** These headers are made of metal and glass, exhibiting excellent airtightness and insulation properties. In particular, their thermal conductivity is superior compared to other metals. **Main Features** ● Airtightness: 1×10^-9 Pa·m³/sec or less ● Insulation Resistance: 1000 MΩ or more (at DC 500V) ● Finish: Ni-Ep / Ni-Elp + Au-Ep **Used Metal Materials** ● Base: Oxygen-free copper or copper-tungsten ● Leads: Kovar or Fe-Ni 50%
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**Overview** These headers are made of metal and glass, providing excellent airtightness and insulation. In particular, their thermal conductivity is superior compared to other metals. **Main Features** ● Airtightness: 1×10^-9 Pa·m³/sec or less ● Insulation Resistance: 1000 MΩ or more (at DC 500V) ● Finish: Ni-Ep / Ni-Elp + Au-Ep **Used Metal Materials** ● Base: Oxygen-free copper or copper-tungsten ● Lead: Kovar or Fe-Ni 50%
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Fuji Denka is challenging itself with infinite technologies using glass and metal. In the fields of electronics, nanotechnology, and biotechnology that are paving the way for the 21st century, <FUJI-DENKA> contributes to the advancement of cutting-edge research areas. By integrating diverse technologies, we are boldly taking on new business ventures that nurture the next era and are committed to creative activities.