富士紡ホールディングス 近未来商品開発統括部 (BtoBサイト担当部門) Official site

Advanced technology for ultra-precise polishing of essential IT devices for the increasingly important IoT in modern society. This is made possible by our technical capability to produce high-performance polishing pads with stable quality. The POLYPAS series of polishing pads realizes the production of high-quality polishing materials that we take pride in worldwide, thanks to the technology and product development spirit we have cultivated over many years. To meet the polishing performance required by our customers, we deliver unique polishing materials that accommodate all customizations, utilizing the know-how and research and development capabilities gained from numerous case studies. *For more details, please refer to the related links or feel free to contact us.

- FP Series: Non-woven type - FXA Series: Rigid polyurethane (non-filler type) - FX Series: Rigid polyurethane (filler-added type) - Suede Series - Back Pad Series: Waxless retention (with frame, without frame) 【Related Keywords】 Polishing, precision polishing, polishing materials, polishing pads, polishing cloths, polishing pads, back pads, polyurethane pads, templates, POLYPAS, grinding, grinding cloth, grinding materials

■ For primary and finishing polishing of silicon and compound semiconductor wafers ■ For polishing metal discs such as aluminum and nickel ■ For polishing glass substrates for LCDs, photomasks, and hard disks ■ For polishing optical lenses and various optical glass components ■ For CMP (Chemical Mechanical Polishing) ■ For polishing other materials such as plastic lenses, stainless steel, and copper plates