[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197BOD)
TECHNICAL INFOMATION INSTITUTE CO.,LTD
- 2.XD, 3D integration and substrate materials, encapsulation and bonding technologies, heat dissipation materials - －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Advanced Semiconductor Package Technologies and Their Structures, Process Technologies Chapter 2: Implementation Technologies and Heat Dissipation Measures for Next-Generation Power Semiconductors Chapter 3: Design of Semiconductor Encapsulation Materials, Required Characteristics, and Characteristic Improvement Technologies Chapter 4: Adhesion, Bonding Technologies, and Reliability Evaluation in Semiconductor Packaging Chapter 5: Material Technologies for Printed Circuit Boards and Wiring Formation, Processing Technologies Chapter 6: Development Trends of Thermal Management Materials and Thermal Property Evaluation Chapter 7: Analysis and Inspection Technologies for Semiconductor Packages －－－－－－－－－－－－－－－－－－－－－－－－－－ ● Published: April 28, 2023 ● Authors: 56 ● Format: A4 size, 613 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-945-4 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 69,300 yen (tax included) ISBN: 978-4-86798-105-4 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
