[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197) [Available for Preview]
TECHNICAL INFOMATION INSTITUTE CO.,LTD
- 2.XD, 3D integration and substrate materials, encapsulation and bonding technologies, heat dissipation materials - ★ The miniaturization of integrated circuits approaching its limits and the differentiation of advanced semiconductors hinge on packaging technology! This publication covers the transformation of packaging technology associated with chiplets and 3D integration, as well as new materials and process technologies. －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Advanced Semiconductor Packaging Technologies and Their Structures, Process Technologies Chapter 2: Implementation Technologies and Heat Dissipation Measures for Next-Generation Power Semiconductors Chapter 3: Design of Semiconductor Encapsulation Materials, Required Characteristics, and Characteristic Improvement Technologies Chapter 4: Adhesion and Bonding Technologies in Semiconductor Packaging and Reliability Evaluation Chapter 5: Material Technologies for Printed Circuit Boards and Wiring Formation, Processing Technologies Chapter 6: Development Trends of Heat Management Materials and Thermal Property Evaluation Chapter 7: Analysis and Inspection Technologies for Semiconductor Packages －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: April 28, 2023 ● Format: A4, 613 pages ● Authors: 56 ● ISBN: 978-4-86104-945-4 －－－－－－－－－－－－－－－－－－－－－
