TECHNICAL INFOMATION INSTITUTE CO.,LTD Official site

  • SEMINAR_EVENT

Requirements for High-Speed Communication Printed Circuit Board Materials and Reduction of Transmission Losses

TECHNICAL INFOMATION INSTITUTE CO.,LTD

TECHNICAL INFOMATION INSTITUTE CO.,LTD

■ Instructors 1. Mr. Seiji Koda, Chief Engineer, Electronic Materials Division, Panasonic Industry Co., Ltd., Electronic Substrate Business Unit 2. Dr. Hoshise Suzuki, Material Design Group, Functional Design Technology Laboratory, R&D Headquarters, Shiga Research Institute, Mitsubishi Chemical Corporation, Specialty Materials Business Group 3. Mr. Takahiro Nishikawa, Chief Researcher, Technical Research Institute, Kurashiki Spinning Co., Ltd. 4. Mr. Takeshi Kumano, Leader, Functional Materials Team, Chemical Research and Development Headquarters, Shikoku Chemical Industries, Ltd. ■ Event Details Date and Time: July 5, 2023 (Wednesday) 10:15 AM - 4:50 PM *The schedule has been changed from the date previously announced in some brochures (July 13) to the above date. (April 28) Venue: Live streaming via ZOOM *There will be no lectures held at a physical venue Please check "here" for connection confirmation and attendance procedures for the live seminar. Participation Fee: 66,000 yen per person (including tax and materials) [If two or more participants from the same company apply simultaneously, the fee is 60,500 yen per person (including tax)] [Discounts are available for universities, public institutions, and medical institutions. For details, please refer to the "Academic Price" section above.]

  • Date and time Tuesday, Jul 05, 2022
    10:15 AM ~ 04:50 PM
  • Capital Live streaming using Zoom *No lectures will be held at the venue.
  • Entry fee Charge