TECHNICAL INFOMATION INSTITUTE CO.,LTD Official site

  • SEMINAR_EVENT

Mechanism of foam molding, bubble control, measurement, application

TECHNICAL INFOMATION INSTITUTE CO.,LTD

TECHNICAL INFOMATION INSTITUTE CO.,LTD

■ Lecturer 【Part 1】 Dr. Minoru Shinbo, President of SMS Co., Ltd. (Professor Emeritus, Kanazawa Institute of Technology) 【Part 2】 Mitsuru Kasuga, Development Group, Research and Development Department, Eiwa Chemical Industry Co., Ltd. 【Part 3】 Akihiro Naito, Molding Technology Group, Injection Machinery Department, Japan Steel Works, Ltd. Hiroshima Works 【Part 4】 Shunichi Baba, President of Sanwa Trading Co., Ltd. ■ Event Details Date and Time: September 7, 2023 (Thursday) 10:00 AM - 5:00 PM Venue: [Tokyo, Gotanda] Nikkou Gotanda Building 8F, Technical Information Association Seminar Room Participation Fee: 66,000 yen per person (including tax, with materials) [60,500 yen per person for companies applying with two or more participants at the same time] [Discounts are available for universities, public institutions, and medical institutions. Please refer to the "Academic Price" section above for details.] ※ Applications will close as soon as the capacity is reached.

  • Date and time Wednesday, Sep 07, 2022
    10:00 AM ~ 05:00 PM
  • Capital Online: Live streaming using Zoom
  • Entry fee Charge