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Development examples of semiconductor package materials and warpage reduction.

TECHNICAL INFOMATION INSTITUTE CO.,LTD

■ Instructors 1. Mr. Gen Sho Kumamoto, Sumitomo Bakelite Co., Ltd. Information and Communication Materials Research Institute 2. Mr. Goji Maeda, Chief Researcher, Toyobo Co., Ltd. General Research Institute 3. Mr. Masaki Higashi, Professor, Tokyo Institute of Technology Frontier Materials Research Institute ■ Event Details Date and Time: September 15, 2023 (Friday) 10:30 AM - 4:15 PM Venue: Live streaming via Zoom *No lectures will be held at a physical venue Please check "here" for connection confirmation and attendance procedures for the live seminar. Participation Fee: 60,500 yen per person (including tax and materials) [55,000 yen per person only for simultaneous applications of two or more from the same company] [Discounts are available for individuals from universities, public institutions, and medical institutions. Please see "Academic Pricing" above for details.]