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Trends in the development of next-generation power semiconductors and junction, packaging technology.

TECHNICAL INFOMATION INSTITUTE CO.,LTD

■ Instructors 1. Professor Yasushi Yamada, Ph.D. (Engineering), Department of Electrical and Electronic Engineering, Faculty of Engineering, Daido University 2. Associate Professor Dento Chen, Special Appointment, Flexible 3D Implementation Collaborative Research Institute, Osaka University, Institute of Industrial Science 3. Hiroshi Kimura, Department Manager, Device Development Department, Development Division, Semiconductor Business Headquarters, Fuji Electric Co., Ltd. ■ Event Details Date and Time: September 4, 2023 (Monday) 10:30 AM - 4:00 PM Venue: Live streaming via Zoom *No lectures will be held at the venue Please check "here" for connection confirmation and attendance procedures for the live seminar. Participation Fee: 60,500 yen per person (including tax and materials) [55,000 yen per person only for companies applying with two or more participants simultaneously] [Discounts are available for universities, public institutions, and medical institutions. For details, please see the "Academic Pricing" section above.]