Latest Trends in Advanced Semiconductor Packaging Technology and Substrate Materials, Process Technologies

TECHNICAL INFOMATION INSTITUTE CO.,LTD
■ Instructors * The following changes have been made from the content previously published in some pamphlets. (6/30) 1. Renya Kawano, Ph.D. (Engineering), Specially Appointed Researcher, System Design Research Center (d.lab), The University of Tokyo 2. Masahisa Oze, Department Manager, Laminated Materials Development Department, Development Center, Electronics Business Division, Resonac Corporation 3. Akira Takahashi, Ph.D. (Engineering), Director, Technology Development, Sun Chemical Corporation ■ Event Details Date and Time: September 12, 2023 (Tuesday) 10:15 AM - 4:15 PM Venue: Live streaming via ZOOM * There will be no lectures held at the venue Please check "here" for connection confirmation and participation procedures for the live seminar. Participation Fee: * The participation fee was incorrectly stated in some pamphlets. The correct fee is as follows: 60,500 yen per person (including tax and materials) [If two or more participants from the same company apply simultaneously, the fee is 55,000 yen per person (including tax)] [Discounts are available for individuals from universities, public institutions, and medical institutions. Please refer to the "Academic Price" section above for details.]

-
Date and time Monday, Sep 12, 2022
10:15 AM ~ 04:15 PM
- Capital Online: Live streaming using Zoom
- Entry fee Charge