[Book] Formulation Design and High Functionality of Epoxy Resins (No. 2222)
TECHNICAL INFOMATION INSTITUTE CO.,LTD
- High heat resistance, high thermal conductivity and insulation, low dielectric constant, toughening - ★ Concrete measures that respond to the latest electronics packaging materials such as high-frequency substrates and semiconductor encapsulation can be understood from the examples of advanced companies! ★ Optimization of the selection, usage amount, and curing process conditions of the ideal curing agent! Reduction of environmental impact through the realization of low-temperature rapid curing! －－－－－－－－－－－－－－－－－－－－－ Chapter 1: Characteristics of Epoxy Resins, Synthesis Reactions, and Curing Control Technologies Chapter 2: Mastering the Use of Epoxy Resins Chapter 3: Evaluation Methods for Epoxy Resins Chapter 4: Examples of Improved Heat Resistance and Flame Retardancy Chapter 5: Examples of Enhanced Thermal Conductivity and Insulation, and Reduced Dielectric Constant Chapter 6: Technologies for Toughening, Durability, and Corrosion Resistance of Epoxy Resins Chapter 7: Technologies for Improving Adhesion of Epoxy Resins Chapter 8: Trends in Environmental Compatibility of Epoxy Resins －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: October 31, 2023 ● Format: A4 size, 481 pages ● Authors: 52 individuals ● ISBN: 978-4-86104-988-0 －－－－－－－－－－－－－－－－－－－－－
