[Book] Trends in the Development of Next-Generation High-Speed and High-Frequency Transmission Materials (No. 2274) [Available for Preview]
TECHNICAL INFOMATION INSTITUTE CO.,LTD
- Low dielectric resin, high-frequency circuit boards, semiconductor package materials, optoelectronic integration - ★ A comprehensive collection of devices and materials supporting high-speed and large-capacity communication driven by the spread of 5G/6G and generative AI! ★ Requirements for materials used in 2.xD, 3D packaging, chiplets, and next-generation packages, along with development examples from various companies. ---------------------------- Chapter 1: Development Trends and Wiring Formation of High-Speed Communication Printed Circuit Board Materials Chapter 2: Development Trends of Low Dielectric Resin and Evaluation of Dielectric Constant Chapter 3: Material Development for Advanced Semiconductor Packages Chapter 4: Development Trends of Electronic Components for High-Speed High-Frequency Communication Chapter 5: Development Trends of Optical Interconnects and Integration Technologies ---------------------------- ● Publication Date: December 27, 2024 ● Format: A4, 600 pages ● Authors: 56 ● ISBN: 978-4-86798-054-5 ----------------------------
