[Book] High Thermal Conductivity Technology and Development Cases of TIM (Thermal Interface Material) (No. 2321) [Available for Preview]
TECHNICAL INFOMATION INSTITUTE CO.,LTD
◎The latest technologies for next-generation power devices, semiconductors, automotive equipment, batteries, and motors are all featured in one place! ◎Support for temperatures over 200°C ◎How to use nitride fillers ◎Balancing "insulation" and "heat dissipation" －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Thermal design and heat dissipation for semiconductors, electronic devices, motors, and batteries Chapter 2: High thermal conductivity technology for base resins aimed at heat-dissipating resin design Chapter 3: Surface treatment, dispersion, orientation control of heat-dissipating fillers, and compounding technology with resins Chapter 4: Design of heat-dissipating sheets and technology for improving heat dissipation Chapter 5: Development of high thermal conductivity resin materials for sealing and substrate materials Chapter 6: Measurement, evaluation, and analysis technology for heat dissipation －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: January 30, 2026 ●Format: A4 size, 448 pages ●Authors: 54 individuals ●ISBN: 978-4-86798-129-0 －－－－－－－－－－－－－－－－－－－－－
