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[Available for trial reading] ~ TIM, immersion cooling, vapor chamber, water-cooled heat sink ~

■ Plastic and metal components inside servers compatible with liquid immersion cooling ■ Surface treatment and improvement of cooling efficiency for continuously heat-generating internal substrates ■ Design of heat sinks considering "height," "thickness," and "spacing" for unbiased cooling of multiple GPUs and CPUs ■ Creating escape routes for heat sources with tower-type cooling devices for heat diffusion from horizontal to vertical －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Market trends in AI and generative AI data centers and the required heat dissipation and cooling technologies Chapter 2: Development of heat dissipation materials and components for electronic devices driving AI and HPC, trends, and responses to high heat density Chapter 3: Application of cooling technologies for stable operation of AI and generative AI, and responses to rapid heat generation Chapter 4: Design, analysis, and simulation of heat in advanced semiconductors and electronic devices Chapter 5: Heat dissipation and cooling technologies for devices and equipment equipped with AI and generative AI －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: March 31, 2026 ● Format: A4 size, 408 pages ● Authors: 40 contributors ● ISBN: 978-4-86798-145-0 －－－－－－－－－－－－－－－－－－－－－