[Book] Development of High Thermal Conductivity Materials (No. 2001BOD)
TECHNICAL INFOMATION INSTITUTE CO.,LTD
■ Table of Contents Chapter 1 Mechanisms of Thermal Conductivity in Polymers Chapter 2 Properties of Thermally Conductive Fillers Chapter 3 Techniques for Mixing, Dispersion, and Orientation Control of Fillers Chapter 4 Electrochemical Measurement and Analysis of Solar Cells Chapter 5 Enhancement of Thermal Conductivity in Resins through Structural Control and Molecular Design Chapter 6 Thermal Expansion Control Techniques for Resin Materials Chapter 7 Development of High Thermal Conductivity Elastomers and Carbon Materials Chapter 8 Development of High Thermal Conductivity Resin Materials Required for Power Semiconductors, Automotive Electronics, and LEDs Chapter 9 Design of Heat Dissipation Implementation and Structures for Power Semiconductors, Automotive Electronics, and LEDs Chapter 10 Evaluation and Analysis Techniques for the Thermal Conductivity Properties of Heat Dissipation Materials －－－－－－－－－－－－－－－－－－－－－－－－－－ ● Published: July 31, 2019 ● Authors: 60 individuals ● Format: A4 size, 524 pages Hardcover edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-754-1 ↓↓ The hardcover edition is out of print ↓↓ On-demand edition available Price: 44,000 yen (tax included) ISBN: 978-4-86798-006-4 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
