Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)
Technical Specialized Books - Focusing on Automotive and 5G Applications
Unraveling substrate, wiring, mounting materials, and mounting technology aimed at "miniaturization and high density," "high speed and high frequency," and "flexibility." ■ Key points of this book ◎ Response to automotive and miniaturization for high density ◎ Response to 5G and high-speed communication ◎ Advancement of mounting and design technology
basic information
■Table of Contents (Excerpt) Chapter 1: Future Trends of Implementation Components Chapter 2: Heat Resistance and Vibration Resistance of In-Vehicle Equipment Boards Chapter 3: Car Electronics and In-Vehicle Boards Chapter 4: Development of Board Materials for Power Electronics Devices Chapter 5: High Heat Resistance Implementation Technology for Power Electronics Applications Chapter 6: Development of High-Frequency Board Materials Chapter 7: Design of High-Frequency Boards Chapter 8: Development of Flexible Printed Wiring Boards Chapter 9: Development of Embedded Component Board Technology Chapter 10: Printed Boards for Compact and Thin Layer Applications Chapter 11: Improvement of Connection Reliability Chapter 12: Fine Wiring Formation Technology Chapter 13: Via Formation for Board Stacking Chapter 14: Noise Countermeasure Technology ------------------------------ ●Publication Date: May 29, 2020 ●Authors: 65 ●Format: A4 Size, 713 Pages Hardcover Edition: List Price: 88,000 yen (tax included) ISBN: 978-4-86104-787-9 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available List Price: 44,000 yen (tax included) ISBN: 978-4-86798-012-5 After receiving your order, we will perform simple printing and binding. ------------------------------
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40,000 yen (excluding tax) [including shipping]
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P2
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P2
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2054 Printed Circuit Board BOD
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