[Book] Development of Heat Dissipation and Cooling Technologies and Materials for Electronic Devices (No. 2115)
[Free trial available - Specialized book] ★ Thorough explanation of heat problem countermeasures associated with the high-speed operation of high-performance semiconductors and the high-density implementation of devices.
- Response to 5G, high-speed, and miniaturization - ■ Key Points of This Document Design and Application of Heat Sinks - Resolution of hotspot issues in next-generation power devices - Increase in maximum heat transport per unit - Composite use of graphite and metal materials and application of heat spreaders Development and Application Examples of TIM (Thermal Interface Material) - Orientation technology for transporting large amounts of heat in the thickness direction - Emergence of high thermal conductivity in TIM and reduction of contact thermal resistance - Achievement of high thermal conductivity with less filler content Development of Heat Dissipation Substrates - Improvement of high thermal conductivity and heat shock characteristics of metal-based substrates - Enhancement of thermal conductivity in silicon nitride substrates Prospects for Next-Generation Cooling Technologies - Outlook and challenges of boiling cooling technology - Boiling heat transfer under electric field application Examples of Heat Dissipation Design for Devices - Approach to thermal design and thermal verification, simulation technology - Response to thermal design based on substrate heat dissipation, component technology - Design and evaluation of submerged processor chips aimed at liquid immersion cooling - Key points of thermal design in mobile devices
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■Table of Contents Chapter 1: Design of Heat Sinks and Miniaturization, High Thermal Conductivity Chapter 2: Design of Heat Pipes and Miniaturization, Improvement of Thermal Transport Efficiency Chapter 3: Development and Application of Various TIM Materials Chapter 4: Development of High Heat Dissipation and High Thermal Conductivity Substrates Chapter 5: Development of High-Efficiency Cooling Technologies Chapter 6: Thermal Simulation Technologies for Electronic Device Design Chapter 7: Thermal Conductivity, Temperature Measurement, and Know-How Chapter 8: Heat Dissipation Technologies for Printed Circuit Boards Chapter 9: Heat Dissipation and Cooling Technologies for 5G and Information Communication Devices Chapter 10: Thermal Management Technologies in Sensor Design Chapter 11: Heat Dissipation and Cooling Technologies for Power Electronics Chapter 12: Heat Dissipation and Cooling Technologies for EV Batteries Chapter 13: Heat Dissipation Design for Automotive Electronics ー ー ー ー ー ー ー ー ー ー ー ー ー ー ー ー ●Publication Date: July 30, 2021 ●Format: A4, 676 pages ●Authors: 62 individuals ●ISBN: 978-4-86104-852-4 ー ー ー ー ー ー ー ー ー ー ー ー ー ー ー ー *For more details, please view the brochure by downloading the catalog.
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88,000 yen (including tax) [shipping included] Various discount programs are available. Please contact us.
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2115 Heat-releasing material
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