[Book] High-Performance Design and Application Technology of Polyimide (No. 2165BOD)
Technical Specialty Books - Low Dielectric Properties, Low Thermal Expansion, Transparency, Adhesion and Bonding Properties, Molding Properties -
★ "5G Circuit Boards," "Flexible Organic EL," "Materials for LiB," "Onboard Drive Motors" Explaining the points of high functionality, performance improvement, and product application for new usage development! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Document 【Components Related to 5G】 - Low dielectric loss polyimide for 5G and millimeter waves - Development of low dielectric polyimide adhesives for FPC - Direct metallization on polyimide films 【Flexible Displays】 - Development status and technological direction towards low CTE transparent polyimide - Transparent polyimide for foldable smartphones - Flexible LCD using polyimide film substrates 【Insulation Materials for EVs and HEVs】 - Polyimide coating for onboard drive motors that balances high insulation and high heat resistance - Required characteristics and adhesion improvement for insulation coatings for motor windings 【Lithium-Ion Batteries】 - Development status of polyimide binders for high-capacity silicon-based anodes - Development and challenges of polyimide separators for lithium metal batteries 【Aerospace and Space Fields】 - Development trends of heat-resistant CFRP using polyimide as the base material - Application of thermoplastic polyimide to prepregs
basic information
■ Table of Contents Chapter 1: Synthesis, Design, Structure, Properties, and Characteristics of Various Polyimides Chapter 2: Transparency of Polyimides, Improvement of Optical Properties, and Application Development in Optical Devices Chapter 3: Reduction of Dielectric Loss in Polyimides and Applications in Electronic Circuit Boards and Electronic Devices Chapter 4: Surface Modification of Polyimides, Wiring Formation, and Improvement of Adhesion Chapter 5: High Thermal Conductivity of Polyimides and Application Technologies for Insulating Materials Chapter 6: Application Technologies of Polyimides in Energy Devices and Chemical Processes Chapter 7: Application Technologies of Polyimides in Aerospace and Structural Materials －－－－－－－－－－－－－－－－－－－－－－－－－－ ● Published: August 31, 2022 ● Authors: 57 ● Format: A4 size, 566 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-887-6 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-063-7 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
Price information
44,000 yen (including tax) [shipping included]
Price range
P2
Delivery Time
P2
Model number/Brand name
2165BOD
Applications/Examples of results
For more details, please contact us.
catalog（1）
Download All Catalogs
News about this product（1）
Recommended products
Distributors
The Technical Information Association is engaged in the work of shaping information for engineers and researchers. We research what kind of information engineers and researchers active in fields such as "research and development," "materials," "electronics," and "pharmaceuticals/medical devices" need, and we create products such as seminars, books, and correspondence courses!