[Book] Trends in Advanced Semiconductor Manufacturing Processes and Miniaturization (No. 2220)
【Available for preview】 - Film formation technology, lithography, etching, CMP, cleaning -
Book Title: Latest Trends in Advanced Semiconductor Manufacturing Processes and Miniaturization Technologies --- ★ Amidst the calls for the limits of Moore's Law, how far will the development of miniaturization technologies continue? A comprehensive book covering the latest technologies in the "front-end" of advanced semiconductor manufacturing, where new structures and materials are being applied. --- ■ Key Points of This Book 1 - Latest trends in EUV lithography and the technical challenges of resists, masks, and light sources - The development history of metal resists that breaks conventional wisdom and future challenges - Recent development cases of atomic layer processes (ALD, ALE) that are rapidly gaining momentum in research and development - Latest trends in nanoimprint systems aimed at mass production applications for next-generation semiconductor memory devices - Latest trends in film deposition technologies and process optimization in semiconductor multilayer wiring - Cleaning performance required for advanced semiconductor manufacturing, the reality of contamination, and the latest cleaning technologies - Latest technologies and process control for high aspect ratio etching that enables the miniaturization of integrated circuits - CMP processes and consumable materials that respond to advancements in miniaturization and new materials, along with performance requirements for post-cleaning.
basic information
■ Table of Contents Chapter 1: Polishing and Processing Technologies for Semiconductor Wafers and Ion Implantation Chapter 2: Trends in Film Formation Technology and Production of High-Quality Thin Films Chapter 3: Trends in the Development of Resist Materials and Coating and Removal Technologies Chapter 4: Trends in the Development of Next-Generation Lithography Technologies and Miniaturization Techniques Chapter 5: Trends in the Development of Dry Etching Technologies and Process Control Chapter 6: Trends in the Development of Wet Etching Technologies Chapter 7: Trends in the Development of CMP Processes and Analysis and Evaluation Techniques Chapter 8: Cleaning Technologies for Semiconductors, Mechanisms, and Analysis and Evaluation Techniques －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: September 29, 2023 ● Format: A4, 630 pages ● Authors: 58 individuals ● ISBN: 978-4-86104-982-8 －－－－－－－－－－－－－－－－－－－－－
Price information
88,000 yen (tax included) [shipping included] Various discount programs are available. Please contact us.
Price range
P2
Delivery Time
P2
Model number/Brand name
2220 Semiconductor Manufacturing Process
Applications/Examples of results
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