[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)

【Available for preview】~ Substrate, Joining, Sealing, Cooling Technologies ~

Book Title: Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Management －－－－－－－－－－－－－－－－－－－－－ ◎ Thorough explanation of Si, SiC, GaN, gallium oxide, required characteristics in automotive environments, and implementation examples! ◎ Detailed design guidelines for TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"! －－－－－－－－－－－－－－－－－－－－－ ■ This book includes the following information: - Improvement of resin heat resistance and measures against material expansion - Composite materials of thermally conductive fillers and resins - Development trends of resin substrates, ceramic substrates, and metal substrate materials - Countermeasures for warping, delamination, and breakage caused by inter-material stress due to linear expansion coefficients - Support for high-temperature operation above 300°C and low-temperature operation below freezing - Balancing thermal conductivity, mechanical properties, electrical insulation properties, and strength reliability - Improvement of thermal fatigue characteristics against repeated stress due to heat resistance and differences in linear expansion, and crack prevention - Suppression of electromigration and electrochemical migration - Ensuring moisture resistance, oxidation resistance, heat resistance, and long-term reliability of metal sintered materials

"Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Management" Book Homepage

basic information

- Lowering the temperature and duration of the bonding process - Improvement of heat resistance, high thermal conductivity, corrosion resistance, and low stress response - Durability of flexible high thermal conductivity materials and long-term reliability of TIM －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Trends in the Development and Device Applications of Power Semiconductors Chapter 2: Design and Reliability Improvement of Heat-Resistant and Heat-Dissipating Substrate Materials Chapter 3: Design of Bonding Materials and Technologies and High-Temperature Connection Reliability Chapter 4: Design of Sealing Materials and Response to High-Temperature Operation Chapter 5: Design of Heat-Resistant and Heat-Dissipating Resins and Expansion Relief Materials Chapter 6: Design of Cooling Components, Development of Cooling Technologies, and Implementation Techniques Chapter 7: Thermal Design of Power Devices and High Heat-Resistant, High Heat-Dissipating Packaging Technologies Chapter 8: Reliability and Thermal Characteristics Evaluation of Power Devices －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: August 30, 2024 ● Format: A4 size, 569 pages ● Authors: 60 individuals ● ISBN: 978-4-86798-030-9 －－－－－－－－－－－－－－－－－－－－－