[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)
【Available for preview】~ Substrate, Joining, Sealing, Cooling Technologies ~
Book Title: Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Management －－－－－－－－－－－－－－－－－－－－－ ◎ Thorough explanation of Si, SiC, GaN, gallium oxide, required characteristics in automotive environments, and implementation examples! ◎ Detailed design guidelines for TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"! －－－－－－－－－－－－－－－－－－－－－ ■ This book includes the following information: - Improvement of resin heat resistance and measures against material expansion - Composite materials of thermally conductive fillers and resins - Development trends of resin substrates, ceramic substrates, and metal substrate materials - Countermeasures for warping, delamination, and breakage caused by inter-material stress due to linear expansion coefficients - Support for high-temperature operation above 300°C and low-temperature operation below freezing - Balancing thermal conductivity, mechanical properties, electrical insulation properties, and strength reliability - Improvement of thermal fatigue characteristics against repeated stress due to heat resistance and differences in linear expansion, and crack prevention - Suppression of electromigration and electrochemical migration - Ensuring moisture resistance, oxidation resistance, heat resistance, and long-term reliability of metal sintered materials
basic information
- Lowering the temperature and duration of the bonding process - Improvement of heat resistance, high thermal conductivity, corrosion resistance, and low stress response - Durability of flexible high thermal conductivity materials and long-term reliability of TIM －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Trends in the Development and Device Applications of Power Semiconductors Chapter 2: Design and Reliability Improvement of Heat-Resistant and Heat-Dissipating Substrate Materials Chapter 3: Design of Bonding Materials and Technologies and High-Temperature Connection Reliability Chapter 4: Design of Sealing Materials and Response to High-Temperature Operation Chapter 5: Design of Heat-Resistant and Heat-Dissipating Resins and Expansion Relief Materials Chapter 6: Design of Cooling Components, Development of Cooling Technologies, and Implementation Techniques Chapter 7: Thermal Design of Power Devices and High Heat-Resistant, High Heat-Dissipating Packaging Technologies Chapter 8: Reliability and Thermal Characteristics Evaluation of Power Devices －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: August 30, 2024 ● Format: A4 size, 569 pages ● Authors: 60 individuals ● ISBN: 978-4-86798-030-9 －－－－－－－－－－－－－－－－－－－－－
Price information
88,000 yen (including tax) [shipping included] Various discount programs are available. Please contact us.
Price range
P2
Delivery Time
P2
Model number/Brand name
2260 Power Device
Applications/Examples of results
For more details, please contact us.
catalog（1）
Download All Catalogs
News about this product（1）
-
Notice of participation in the "37th Monozukuri World (Tokyo)" from July 9 (Wednesday) to July 11 (Friday), 2025.
OM Heater Co., Ltd. will be exhibiting at the "37th Monozukuri World (Tokyo)" held at Makuhari Messe. This exhibition features companies dealing with IT, DX products, components, equipment, devices, and measurement products from around the world, where active business negotiations take place with professionals from the design, development, manufacturing, production technology, purchasing, and information systems sectors of domestic and international manufacturing industries. We plan to consolidate AI technology and IoT solution-related exhibited products at the Manufacturing DX Exhibition, and we will also introduce a new area focused on products related to cybersecurity in manufacturing, which has been gaining attention in recent years. We sincerely look forward to your visit.
-
[Book] Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Management (No. 2260)
~ Substrate, Joining, Sealing, Cooling Technologies ~ ◎ A thorough explanation of Si, SiC, GaN, gallium oxide, the required characteristics in automotive environments, and implementation examples! ◎ Detailed guidelines for designing TIMs and thermal sheets that balance "thermal characteristics" and "operational reliability"! ---------------------------- ■ Table of Contents Chapter 1: Trends in the Development and Device Applications of Power Semiconductors Chapter 2: Design of Heat-Resistant and Heat-Dissipating Substrate Materials and Improvement of Reliability Chapter 3: Design of Joining Materials and Technologies and High-Temperature Connection Reliability Chapter 4: Design of Sealing Materials and Response to High-Temperature Operation Chapter 5: Design of Heat-Resistant and Heat-Dissipating Resins and Expansion Relief Materials Chapter 6: Design of Cooling Components, Development of Cooling Technologies, and Implementation Techniques Chapter 7: Thermal Design of Power Devices and High-Heat-Resistant, High-Heat-Dissipating Packaging Technologies Chapter 8: Reliability and Thermal Characteristic Evaluation of Power Devices ---------------------------- ● Publication Date: August 30, 2024 ● Format: A4, 569 pages ● Authors: 60 individuals ● ISBN: 978-4-86798-030-9 ----------------------------
Recommended products
Distributors
The Technical Information Association is engaged in the work of shaping information for engineers and researchers. We research what kind of information engineers and researchers active in fields such as "research and development," "materials," "electronics," and "pharmaceuticals/medical devices" need, and we create products such as seminars, books, and correspondence courses!