[Book] Design and Application of Low Dielectric Constant and Low Dielectric Loss Materials (No. 2332)
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★High-frequency compatibility, comprehensive coverage of development, challenges, and directions in the semiconductor packaging field! ★How to achieve a balance between dielectric performance and substrate processability －－－－－－－－－－－－－－－－－－－－－ ■Key points of this document ◆Improvement of low dielectric properties and adhesion of polymer materials ◆Fillers and additives that enhance low dielectric properties ◆Surface treatments that balance low dielectric properties and adhesion ◆Development of low dielectric materials ◆Development of low dielectric materials
basic information
■Table of Contents Chapter 1: Improvement of Low Dielectric Properties and Adhesion of Polymer Materials through Molecular Design Chapter 2: Development and Application of Additives to Improve Low Dielectric Properties and Adhesion Chapter 3: Development and Application of Fillers and Fiber Materials to Improve Low Dielectric Properties Chapter 4: Development of Film Materials with Excellent Dielectric Properties Chapter 5: Development and Application of Low Dielectric Ceramic Materials Chapter 6: Surface Treatment Technologies to Achieve Low Dielectric Properties Chapter 7: Development of Substrates with Excellent Low Dielectric Properties Chapter 8: Evaluation Techniques for Dielectric Properties and Physical Properties of Low Dielectric Materials －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: March 31, 2026 ●Format: A4, 444 pages ●Authors: 44 individuals ●ISBN: 978-4-86798-144-3 －－－－－－－－－－－－－－－－－－－－－
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88,000 yen (including tax) [shipping included] Various discount programs are available. Please contact us.
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2332 Low dielectric materials
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