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PVA Tepla Corporation Microwave Plasma Treatment Device (for Post-Processing)

We have a proven track record for customers in OSAT around the world and have established our position with reliable performance.

By generating high-density plasma using microwaves (2.45GHz), highly effective surface treatment becomes possible. Additionally, you can choose from various process forms that cater to your different packaging processes. It is designed for chip packaging, including die attach, wire bonding, flip chip, underfill, and resin sealing, for substrate cleaning and surface activation.

Related Link - https://www.process.hakuto.co.jp/product/679/

basic information

PVA Metrology & Plasma Solutions (PVA MPS / Germany) plasma devices are widely used around the world in various applications such as semiconductors, MEMS, and optical devices, providing maximum process reproducibility and improved yield. The microwave (2.45GHz) plasma device achieves a very high electron density and contributes to the suppression of ion kinetic energy, resulting in ideal damage-free process outcomes for various applications.

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Applications/Examples of results

【Application】 Surface pretreatment in various processes such as wire bonding, molding, and flip chip underfill. 【Track Record】 We have a strong track record in the back-end process, serving customers worldwide, including OSATs, and have established our position with reliable performance.

Line up(2)

Model number overview
GIGA 690 The GIGA690 has been used by many customers, including OSAT, since its sale in 2008 as a successor to the PS400 and PS660. You can choose a process mode that accommodates various packaging processes of our customers.
GIGA 80Plus The GIGA 80Plus, equipped with an automatic transport mechanism, was developed in response to market demands for semiconductors and features simple operation in both manual and automatic modes. Depending on your production line, you can choose whether or not to include a load chamber and an unload chamber. If there is no load chamber, inline configuration is possible.

Microwave Plasma Device - Post-Process - PVA Tepla Corporation -

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Microwave Plasma Device - GIGA 690

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Microwave Plasma Device - GIGA 80Plus

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