Ion Beam Milling and Etching Equipment - Hakuto/Ns
We propose the optimal dry etching equipment for processing difficult-to-etch materials such as Au, Pt, and magnetic materials!
Ion beam milling equipment is used as a fine processing device in dry processes, with a wide range of applications from research and development to production. Due to its physical etching process that does not involve chemical reactions, materials such as Au, Pt, magnetic materials, and metal multilayers can be easily processed. 【Features】 (1) Capable of fine processing difficult-to-etch materials (2) Metal multilayers can be processed in a one-step process (3) The self-rotating stage allows for uniform simultaneous processing of multiple wafers (4) The substrate cooling stage (water-cooled or water/gas-cooled) suppresses substrate temperature rise, preventing resist burning (5) The variable stage angle makes taper processing easy (anisotropic etching)
basic information
Bodong Co., Ltd. and NS Co., Ltd. have been jointly developing ion beam milling equipment for a long time, and we design and commercialize everything in-house, from ion sources and power supplies to stages, peripheral devices, and GUIs, allowing for customization according to customer requests. Additionally, our in-house technicians will handle repairs and maintenance after product installation. To allow you to see the actual performance of the equipment, we regularly hold product briefings and demonstrations (generally free of charge, with online options available). Please feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Application】 Used for difficult etching materials such as Au, Pt, magnetic materials, and metal multilayer films. For magnetic devices, sensors, high-frequency devices, and optical devices. Used by domestic and international customers for R&D and mass production applications.
Line up（3）
| Model number | overview |
|---|---|
| 10IBE | This is a compact and space-saving device suitable for research and development purposes. It can accommodate a rotary direct cooling stage (up to 1 piece of Φ4 inches). |
| 20IBE-C | This is a medium-sized device suitable for a wide range of applications from research and development to mass production. It can accommodate a planetary stage that performs self-rotation and revolution (such as φ3 inches x 8 pieces, φ4 inches x 6 pieces, φ6 inches x 4 pieces, etc.). |
| 20IBE-J | This is a large device for mass production and large substrates. It can accommodate a planetary stage that performs self-rotation and revolution (such as φ4 inches x 12 pieces, φ5 inches x 10 pieces, φ6 inches x 8 pieces, etc.). |
