Processing of thin rings for semiconductor and optical devices
Achieving high precision and high quality required in precision fields.
At Rintian Giken, we perform precision machining of thin-walled rings for semiconductor and optical devices. Utilizing our extensive experience in machining difficult materials and our unique know-how, we provide finishes that minimize warping and distortion. We cater to a wide range of needs, from prototypes to mass production. 【Features】 - Geometric tolerance: approximately 0.01 to 0.05, plate thickness: around 10mm, outer diameter: up to approximately φ400 (varies depending on shape, material, and machining content) - Compatible materials: titanium, SUS, aluminum, brass, etc. - Equipped with 3D measuring machines and projectors, capable of measuring dimensions to the micrometer level - Quick turnaround available for single items, small lots, and mass production *For more details, please refer to the materials. Feel free to contact us with any inquiries.
basic information
【Equipment Owned (Partial List)】 ■ 5-Axis Control 3D Machining Center ■ 3D Machining Center ■ General-purpose Milling Machine, Drill Press, Tapping Machine ■ NC Lathe ■ General-purpose Lathe ■ Electrical Discharge Machine ■ Blast Machine ■ Measuring Instruments ■ Image Dimension Measuring Machine ■ Handheld Probe 3D Measuring Machine ■ 3D Coordinate Measuring Machine *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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For more details, please refer to the materials. Feel free to contact us as well.
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Our company is a skilled group with over 25 years of processing experience in difficult-to-cut materials, rare metals, and semiconductors. We strive to consistently provide high-precision, high-quality products tailored to our customers' needs through integrated production from processing to precision cleaning and packaging.