Hybrid IC
Simplifying and miniaturizing circuit boards without the hassle of parts procurement or equipment. Capable of providing custom products with short lead times and low costs.
Our company manufactures "Hybrid ICs" that integrate circuit design technology, assembly technology, and measurement technology based on years of experience in thick film manufacturing. This allows for simplification and miniaturization of circuit boards without the hassle of component procurement or equipment. It also contributes to reduced development time and lower management costs. We also support production using alumina ceramic substrates, which excel in heat dissipation and heat resistance. We welcome inquiries regarding integration density, usage conditions, pricing, and delivery times. 【Features】 ■ Simplification and miniaturization of circuit boards through modularization ■ High reliability due to low thermal expansion and high thermal conductivity of alumina substrates ■ Reduction of management costs through simplified component management ■ Adjustments through operational trimming ■ Custom design enabling flexible circuit design *For more details, please refer to the materials. Feel free to contact us with any inquiries.
basic information
【Applications】 ◎ Automotive equipment ◎ Heating, ventilation, and air conditioning equipment ◎ Wireless equipment ◎ Amusement equipment ◎ Industrial equipment ◎ Electrical devices *For more details, please refer to the materials. Feel free to contact us as well.
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Applications/Examples of results
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