Electronic material substrate "Alumina thick film printed substrate"
A high-reliability electronic material substrate with baked electrode materials and resistive materials.
The "Alumina Thick Film Circuit Board" is a high-reliability electronic material substrate that has excellent heat dissipation and heat resistance, with electrode materials and resistive materials baked onto an alumina substrate. Our company produces and sinters alumina substrates at our affiliated company, "Ina Ceramic Co., Ltd.," and has established a consistent high-quality line that includes circuit printing, sintering, resistance value adjustment, component mounting, molding, and electrical testing. It can be utilized in main applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. 【Features of Alumina Substrate】 ■ Material: 96% Alumina ■ Color: White ■ Specific Gravity: 3.8±0.1 ■ Water Absorption (%): ≧0.1 ■ Flexural Strength (MPa): 215≦ ■ Hardness (GPa): 13.7±2.4 ■ Insulation Breakdown Voltage (V/mm): 1×10^7≦ *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Circuit Specifications (Substrate)】 ■ Material: 96% Alumina ■ Substrate Size: 50.4mm × 50.4mm to 116mm ■ Thickness: 0.35mm, 0.40mm, 0.635mm, 0.8mm, 1.0mm ■ Through Hole Diameter: Minimum 0.1mm, filling possible ■ Distance Between Through Holes: At least the thickness of the board ■ Distance from Through Hole to Edge of Substrate: At least the thickness of the board *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ Automotive electronic components, communication industry equipment, power supplies, safety devices, etc. *For more details, please refer to the PDF document or feel free to contact us.
