Reduction of total manufacturing costs through the modularization of hybrid ICs!
【Space-saving of circuit boards】 We simplify and miniaturize circuit boards without the hassle of component procurement or equipment. Custom products available!
Our company manufactures "Hybrid ICs" that integrate circuit design technology, assembly technology, and measurement technology based on many years of thick film manufacturing expertise. This allows for simplification and miniaturization of circuit boards without the hassle of component procurement or equipment. It also contributes to shortening development time and reducing management costs. We also accommodate production using alumina ceramic substrates, which excel in heat dissipation and heat resistance. We welcome inquiries regarding integration density, usage conditions, pricing, and delivery times. 【Features】 ■ Simplification and miniaturization of circuit boards through modularization ■ High reliability due to low thermal expansion and high thermal conductivity of alumina substrates ■ Reduction of management costs through simplified component management ■ Adjustments through operational trimming ■ Custom design enabling flexible circuit design *For more details, please refer to the materials. Feel free to contact us with any inquiries.
basic information
【Applications】 ◎In-vehicle equipment ◎Heating, ventilation, and air conditioning equipment ◎Wireless equipment ◎Amusement equipment ◎Industrial equipment ◎Electrical devices *For more details, please refer to the materials. Feel free to contact us as well.
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Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
