[White Paper] Side Fill Technology
Simple yet robust technology that reduces stress on DRAM modules.
For more details, please refer to the PDF document or feel free to contact us. This white paper aims to explain the challenges faced by the embedded industry in harsh environments and why side-fill is the optimal solution.
basic information
Under harsh usage environments, there is a possibility of damaging or breaking BGA and solder. As the module size decreases, the BGA also becomes smaller, resulting in reduced robustness. Nevertheless, DRAM modules are often subjected to mechanical stress from shock, vibration, and extreme temperature fluctuations in everyday environments. There are measures that can be taken to mitigate these challenges. - For more information, please refer to the materials -
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For more details, please refer to the materials.
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Innodisk Japan Co., Ltd. is the Japanese branch of Taiwan's Innodisk Corporation, specializing in products for industrial and embedded applications (flash storage SSDs and DRAM modules) and providing sales and technical support within Japan. In addition to sales support, we primarily focus on technical support, with dedicated FAE staff on-site to meet our customers' needs. Our products are manufactured at our own factory located at our headquarters in Taiwan. We are capable of flexible delivery timelines.