[White Paper] Side Fill Technology
Simple yet robust technology that reduces stress on DRAM modules.
For more details, please refer to the PDF document or feel free to contact us. This white paper aims to explain the challenges faced by the embedded industry in harsh environments and why side-fill is the optimal solution.
basic information
Under harsh usage environments, there is a possibility of damaging or breaking BGA and solder. As the module size decreases, the BGA also becomes smaller, resulting in reduced robustness. Nevertheless, DRAM modules are often subjected to mechanical stress from shock, vibration, and extreme temperature fluctuations in everyday environments. There are measures that can be taken to mitigate these challenges. - For more information, please refer to the materials -
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the materials.
