Reinforced solder joint - Side fill technology
Side fill enables products to be strengthened at low cost!
For more details, please refer to the PDF document or feel free to contact us. In particular, for BGA package devices, we provide side fill for products equipped with BGA package devices to reinforce the joint between the components and the substrate. This allows for enhanced durability and ensures reliability against vibrations and temperature changes.
basic information
[Features] ◆ Preparing products for harsh conditions ◆ Reliable operation even in extreme temperature environments ◆ Ensuring high effectiveness at low cost ~ Please download to see more ~
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For more details, please refer to the PDF document or feel free to contact us.
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Innodisk Japan Co., Ltd. is the Japanese branch of Taiwan's Innodisk Corporation, specializing in products for industrial and embedded applications (flash storage SSDs and DRAM modules) and providing sales and technical support within Japan. In addition to sales support, we primarily focus on technical support, with dedicated FAE staff on-site to meet our customers' needs. Our products are manufactured at our own factory located at our headquarters in Taiwan. We are capable of flexible delivery timelines.