Reinforced solder joint - Side fill technology
Side fill enables products to be strengthened at low cost!
For more details, please refer to the PDF document or feel free to contact us. In particular, for BGA package devices, we provide side fill for products equipped with BGA package devices to reinforce the joint between the components and the substrate. This allows for enhanced durability and ensures reliability against vibrations and temperature changes.
basic information
[Features] ◆ Preparing products for harsh conditions ◆ Reliable operation even in extreme temperature environments ◆ Ensuring high effectiveness at low cost ~ Please download to see more ~
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
