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Water-soluble flux solder "EVASOL WSG Series"

Good water washability, excellent wettability, and low scattering.

Good water washability "EVASOL WSG Series" uses a water-soluble base material instead of rosin. Residues after soldering can be easily washed away with water. Excellent wettability By selecting surfactants tailored to the base material, wettability has been improved. Stable mounting is possible regardless of the type of components. Reduced splatter Thanks to the effects of special surfactants, solder and flux splatter has been reduced. This enables the assurance of higher mounting quality. 【Features】 ■ Good water washability ■ Excellent wettability ■ Significantly reduced splatter *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.ishikawa-metal.com/evasol_detail.php?cd…

basic information

【Specifications】 ■Compatible solder alloys: J3 (Sn-Ag3.0-Cu0.5), J9 (Sn-Ag3.5-Cu0.7) ■Compatible flux amounts: 2±0.3, 3±0.3 ■Flux type: Halogen-free ■Halide content: 1.6% to 2.4% ■Insulation resistance: 1.0×10^8Ω or more ■Wire diameter  ・J3: 1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2, 0.15, 0.1  ・J9: 1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2   *For more details, please refer to the PDF document or feel free to contact us.

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Delivery Time

Applications/Examples of results

- Soldering to the hard disk drive - Soldering that requires washing with water after soldering

Detailed information

水洗浄型やに入りはんだ『EVASOL WSGシリーズ』

PRODUCT

石川金属株式会社 会社紹介

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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.