Laser printing solder paste "EVASOL 8229 Series"
Good finish even with rapid laser heating, compatible with printing methods.
Compatible with laser processing The 'EVASOL 8229 series' is compatible with light heating methods such as lasers. It suppresses solder balls, which can be problematic during rapid heating, achieving excellent finishing quality. Compatible with printing methods Until now, it has been difficult for laser solder pastes to accommodate printing methods. This product is now compatible, allowing transfer with existing equipment. A new operational method By combining light heating and printing, a new operational method has become possible. SMT components such as QFPs can be mounted in a short time without using a reflow oven. 【Features】 ■ Prevents solder balls ■ Compatible with light heating of SMT packages ■ Stable viscosity characteristics *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications】 ■Compatible solder alloys: J3 (Sn-Ag3.0-Cu0.5), R4 (Sn-Ag0.3-Cu0.7) ■Powder particle size: 38 to 20 µm ■Flux content: 10.5 ± 1.0% ■Flux type: MIL-RMA ■Halide content: 0.10 to 0.14% ■Copper plate/copper mirror corrosion test: No corrosion ■Insulation resistance test: 5.0 × 10^8 Ω or more *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
- When you want to combine printing methods and laser soldering - When you want to suppress solder balls
Detailed information
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The "EVASOL 8229 series" is compatible with light heating methods such as lasers. It suppresses solder balls, which can be problematic during rapid heating, and achieves excellent finishing quality.
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So far, we have addressed printing methods that were difficult with laser solder paste. Transfer using existing equipment is possible.
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By combining light heating and printing, a previously unattainable operation has become possible. SMT components such as QFP can be mounted in a short time without using a reflow oven.
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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.