Low Residue Solder Paste "EVASOL 6001 Series"
Reduce residue volume, compatible with ICT testing, good wettability and high assembly quality.
Compatible with ICT testing The 'EVASOL 6001 series' uses a special base material in the flux to reduce residue levels. It demonstrates a high vertical rate in ICT testing. Good wettability It uses a special surfactant and shows wettability equivalent to products with normal residue levels. High printing stability It prevents reactions between the flux and powder, preventing viscosity changes during continuous printing. Stable mounting is possible. 【Features】 ■ High vertical rate in continuity testing ■ High stability in continuous printing ■ Good wettability *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 45 to 25 µm ■ Flux content: 10.5 ± 1.0% ■ Flux type: MIL-RMA ■ Halide content: 0.03% or less ■ Copper plate/copper mirror corrosion test: No corrosion ■ Insulation resistance test: 5.0 × 10^8 Ω or more *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
When you want to solder while reducing flux residue.
Detailed information
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The "EVASOL 6001 series" uses a special base material in the flux to reduce residue levels. It demonstrates a high vertical rate in ICT testing.
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It uses a special surfactant and demonstrates wettability equivalent to products with a normal residue amount.
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It prevents the reaction between flux and powder and prevents viscosity changes during continuous printing. Stable implementation is possible.
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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.