Cleaning-compatible solder paste "EVASOL 8825 Series"
Achieves excellent cleaning performance, compliant with the halogen-free standard J-STD-709.
Corresponding to the cleaning process The "EVASOL 8825 series" uses materials with high compatibility with solvents based on flux. It improves the cleanability of flux residues. Compliance with halogen-free standards It does not contain chlorine (Cl) or bromine (Br), which can cause dioxins, and complies with the halogen-free standard J-STD-709. High printing stability It prevents the reaction between flux and powder, thereby preventing viscosity changes during continuous printing. Stable mounting is possible. 【Features】 ■ Good cleanability ■ High continuous printing stability ■ Good wettability *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Specifications】 ■ Compatible solder alloy: J3 (Sn-Ag3.0-Cu0.5) ■ Powder particle size: 38 to 25µm ■ Flux content: 11.0±0.5% ■ Flux type: Halogen-free ■ Halide content: Cl: below 900ppm, Br: below 900ppm, Cl + Br: below 1500ppm ■ Copper plate and copper mirror corrosion test: No corrosion ■ Insulation resistance test: Above 5.0×10^8Ω *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
- When cleaning is necessary after soldering - Soldering of halogen-free components
Detailed information
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The "EVASOL 8825 series" uses materials with high compatibility with solvents based on flux. It improves the cleanability of flux residues.
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- Soldering is possible on aluminum wire. The oxide film on the aluminum surface is strong, making it difficult to remove with flux, but this product can remove the oxide film, allowing for soldering. - No cleaning process is required. Although it is a highly active flux, it only activates during soldering (at high temperatures), so no cleaning process is needed after soldering. - No prior removal of the urethane coating is necessary. For some aluminum coil wires, the heat from the solder and the flux can remove the urethane coating, allowing for soldering on aluminum wires with the urethane coating removed. Therefore, there is no need to separate the coating removal and soldering processes, which increases productivity.
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It prevents the reaction between flux and powder, and prevents viscosity changes during continuous printing. Stable implementation is possible.
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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.