Soldering defect: Flux scattering (solder paste)
I will introduce you to flux dispersion (solder paste).
The following detailed information describes the flux dispersion in solder paste, so please check it.
basic information
For more details, please feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please feel free to contact us.
Detailed information
-
Contents and Issues of Flux Dispersion in Paste During the reflow heating of solder paste, flux may disperse. If the dispersed flux adheres to the contact points of connector components or memory sockets, it can cause poor conductivity and malfunction.
-
Causes of Flux Spattering in Solder Paste The cause of flux spattering is the rapid boiling of the flux. During reflow heating, gas is generated due to the evaporation of solvents and the decomposition of activators within the flux. In the heating zone 1 from the start of reflow to preheating, and in the heating zone 2 from the end of preheating to the main heating, the temperature of the solder paste rises rapidly. Consequently, gas is suddenly generated from the flux, leading to boiling and spattering. Additionally, if a large amount of gas is generated after the solder melts, it tends to accumulate within the molten solder, making it easier for spattering to occur when this gas escapes.
-
Measures to Prevent Flux Spattering in Solder Paste The following measures can be taken to prevent flux spattering: <Measures Using Reflow Profile> - Reduce the temperature gradient in Heating Zone 1 and Heating Zone 2. <Measures Using Solder> - Change the surfactant in the flux to one with a wider decomposition temperature range. This allows the surfactant to decompose gradually over a wide temperature range, preventing the generated gas from accumulating inside the molten solder and thus reducing the likelihood of spattering. We offer flux spattering prevention solder paste, so please contact us for more information.
catalog（2）
Download All Catalogs
Recommended products
Distributors
Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.