Blow Molding Simulation Using B-SIM for the Packaging Industry
Simulate blow molding to streamline packaging material development.
In the packaging industry, there is a demand for balancing product protection and cost reduction. Blow molding significantly affects the quality and cost of products due to the shape and wall thickness of containers, making the reduction of molding defects and material optimization crucial. B-SIM addresses these challenges by simulating the blow molding process. 【Application Scenarios】 - Shape consideration during the design phase of packaging containers - Cost reduction through material optimization - Prediction and countermeasures for molding defects 【Benefits of Implementation】 - Reduction in the number of prototypes - Reduction in material costs - Shortening of product development time
basic information
**Features** - Import of mold shapes from STL, DXF, Patran, and VRML files is possible. - Material slip due to differences in mold materials is reproduced based on the friction coefficient. - The material model employs the integral-type viscoelastic models K-BKZ and Leonov. - Accurate simulation of time dependence and large deformations, with high precision reproduction of sagging in sheets and parisons. - Physical property data for major materials is already registered, allowing for immediate analysis to begin. - Three different damping functions that accommodate strain hardening. - Adoption of the WLF temperature dependence model. - Realization of short computation times through the use of a multi-threaded solver and batch analysis system compatible with 64-bit parallel processors. - Detailed display of thickness, temperature, stress, and elongation after molding using a 3D color scale and graphs along arbitrary cut lines. - Prediction of molding defects and their risks through contact status between the mold and sheet, highlighting large deformations of the sheet, and weight calculation functions for arbitrary parts. - Analysis results can be exported to ANSYS, IGES, DXF, Cosmos/M, Patran, and LS-Dyna files for structural analysis.
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Model number/Brand name
Acuform B-SIM
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Our company handles products that are adopted by world-class companies. These products incorporate cutting-edge technologies not found in Japanese products, enabling the promotion of rationalization and cost reduction in manufacturing and development environments, and they are guaranteed to bring benefits to the companies that implement them. Additionally, we provide support for overseas products with the same rapid response as domestic manufacturers. ◎ Dynamic viscoelasticity measurement device ◎ Stress relaxation measurement device ◎ Drop weight impact testing machine ◎ Multicolor light 3D optical profiler ◎ Nano/micro indenter ◎ Tribometer ◎ Moisture meter for polymers ◎ Twin capillary rheometer for melt property material development ◎ Flow analysis software ◎ Molding analysis software ◎ Ultra-precision feeder ◎ Mass flow quantitative feeder ◎ Automatic adjustment weight-type blender ◎ Dehumidifying dryer for polymers ◎ Color spectrometer ◎ Equipment for shortening molding cycles ◎ Rubber measurement-related equipment Dynamic measurement + vulcanization testing machine Rheometer Carbon dispersion meter Mooney viscometer Hardness and density meter Density and specific gravity meter Specific gravity meter for uncured rubber Durometer Durability and fatigue testing machine Rebound tester Wear testing machine ◎ Comprehensive valve manufacturer