Ultrasonic grinding machine optimal for processing hard and brittle materials such as SiC and PCD.
Achieve improved processing efficiency and processing accuracy in the machining of hard and brittle materials such as SiC (silicon carbide) and PCD (polycrystalline diamond)!
basic information
■Features ○ By applying ultrasonic vibrations in the radial direction of the diamond grinding wheel, it is possible to efficiently process with the combined effect of 'grinding force + crushing force from ultrasonic hammering.' ○ The processed surface becomes finer than the grit of the grinding wheel, so when using a grinding wheel of the same grit, the surface is cleaner with ultrasonic assistance. ○ It reduces clogging of the grinding wheel, allowing for longer dressing intervals. Additionally, it enables an increase in cutting pitch and feed speed, which can shorten processing time. ○ Customization is possible according to the material and size of the target workpiece. ■Main Specifications ○ Table working surface: 150mm × 102mm ○ Table movement (left and right): 10mm to 100mm ○ Grinding wheel movement (front and back): 100mm ○ Distance from the top of the table to the center of the grinding wheel axis: 95 to 245mm ○ Maximum load capacity of the table: 7kg ○ Maximum number of reversals: 1000 times/min ○ Maximum rotational speed of the grinding wheel: 3000 min⁻¹ ○ Control device: FANUC 0i-M series *For more details, please contact us.
Price information
16 million yen The price varies depending on the special specifications.
Price range
P7
Delivery Time
OTHER
Model number/Brand name
Iwashita
Applications/Examples of results
■Materials that the ultrasonic grinding machine 'IUG0101' excels at 〇PCD (polycrystalline diamond) 〇SiC (silicon carbide) 〇Glass 〇Cemented carbide 〇Ceramics (alumina, quartz) *Please consult us for other materials. *For more details, please contact us.
