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December 17-19, Tokyo BS "SEMICON JAPAN 2025" Joint Exhibition by the JGC Group
We will be exhibiting jointly with the JGC Group at "SEMICON JAPAN 2025" held at Tokyo Big Sight. <JGC Group Exhibition Overview> Since its founding, the JGC Group has been involved in various fields, including EPC (Engineering, Procurement, and Construction) for plants and factories representing oil refining and natural gas, as well as diverse businesses such as the manufacturing of catalysts, inorganic materials, and fine ceramics components. In the semiconductor field, we contribute to the semiconductor industry in multiple ways, focusing on "design and construction of semiconductor-related factories," "components for semiconductor manufacturing equipment," and "materials for semiconductor materials." <JFC Exhibition Overview> In the Japan Fine Ceramics corner, we will introduce products and application examples related to semiconductors. ● Application examples of "metal-ceramic composite materials" for temperature-controlled wafer chucks and cooling jackets ● Thin-walled rib structures "SiC ceramics" for lightweight, high-rigidity stages ● Ceramic substrates and thin-film metallized substrates ● High-performance "silicon nitride substrates" for power semiconductors ● Transparent alumina, low dielectric loss alumina, Li-ion conductors, cells for SOFC/SOEC, pressure sensors for hydrogen environments We look forward to welcoming you at our booth.
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Exhibited at the 2017 High-Performance Ceramics Exhibition at Tokyo Big Sight from April 5 to 7.
Thank you to everyone who visited us. We will be exhibiting at the "High-Performance Ceramics Exhibition" held at Tokyo Big Sight in April. At our booth, we will showcase: - A new product that further enhances the fracture resistance of silicon nitride ceramics and improves thermal conductivity. - A new material that does not bend like iron, utilizing the lightweight properties of aluminum, known as "composite materials of metals and ceramics." - "Ceramic substrates" characterized by thin film and film formation technology. If you have any concerns regarding equipment design, component design, thermal design, or anything else, please feel free to stop by our booth for a consultation. We look forward to seeing you.