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Recommended soldering conditions

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Recommended soldering conditions

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A detailed explanation of recommended soldering conditions such as storage conditions and humidity levels!

This document explains the "recommended soldering conditions" for Delay Line products handled by JPC Corporation. To ensure proper "flow" of the solder, a printing thickness of 0.15mm or more for solder paste is recommended. 【Recommended Soldering Conditions】 ≪Dip Soldering Conditions≫ ■ Process/Conditions - Preheating/100℃ to 150℃ - Solder dip temperature/Peak 260℃ Max. 10 seconds or less - Cooling/Natural cooling to below 100℃ *For more details, please refer to the PDF document or feel free to contact us.

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【Other Recommended Soldering Conditions】 ≪Manual Soldering Conditions≫ ■Tip Temperature / 340℃ Max. ■Processing Time (per terminal) / 3.5 seconds Max. *For more details, please refer to the PDF document or feel free to contact us.

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For more details, please refer to the PDF document or feel free to contact us.

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Recommended soldering conditions

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