Brittle material cutting and splitting device
Adopting a high-speed and high-precision coreless linear motor platform!
This device is capable of cutting and processing transparent brittle materials such as sapphire and glass using an ultra-fast laser cutting head. By utilizing a new picosecond process technology, it can quickly handle transparent materials like sapphire and glass, resulting in high efficiency, low cost, and the elimination of loading and unloading during processing since it slices directly with a CO2 laser. Additionally, the device employs a dedicated cutting head for vessel beams, ensuring good processing quality. 【Features】 ■ Utilizes new picosecond process technology ■ Rapid processing of transparent materials such as sapphire and glass ■ Elimination of loading and unloading during processing ■ Good beam quality and high power stability ■ High motion accuracy and strong operational stability ■ Good processing quality *For more details, please download the PDF or feel free to contact us.
basic information
【Performance Parameters (Excerpt)】 ■ Laser Type: Picosecond 1064nm ■ Laser Output: 20W/50W/100W ■ Output Stability: <2% ■ Processing Thickness: <3mm ■ Edge Damage Area: <0.005mm *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
