Laser drill for brittle materials
Adopting ultra-high-speed new process technology! Enables rapid processing of transparent materials such as sapphire and glass.
This device employs a high-speed galvanometer scanner and uses ultra-fast lasers to perform drilling on materials such as sapphire, glass, and silicon. It features a high-speed, high-precision coreless linear motor platform, providing high motion accuracy and strong operational stability. Additionally, it utilizes foreign-made lasers at 1064nm and 532nm, offering good beam quality and stable laser output. 【Features】 - Adoption of ultra-fast new process technology - Capable of rapid processing of transparent materials such as sapphire and glass - Utilizes foreign-made lasers at 1064nm and 532nm - Good beam quality and stable laser output - High-speed and high-precision coreless linear motor platform - High motion accuracy and strong operational stability *For more details, please download the PDF or feel free to contact us.
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【Other Features】 - The device uses a 3D high-speed galvanometer, providing high processing accuracy and good long-term stability. - Automated loading and unloading is possible, saving labor and improving work efficiency. *For more details, please download the PDF or feel free to contact us.
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Our company, as the Japanese subsidiary of Shenzhen JPT Optoelectronics, is engaged in the sales and maintenance of laser-related equipment. We provide the functions and services that our customers need so that they can benefit from laser oscillators and laser systems.