Notice of Participation in INTERMOLD 2025 (Mold Processing Technology Exhibition)
カネコ化学
Kaneko Chemical Co., Ltd. will be exhibiting at "INTERMOLD 2025 (Mold Processing Technology Exhibition)." We will propose a range of products that enhance the efficiency of mold cleaning operations by dissolving and swelling gas residues attached to molds. We will introduce various products that dissolve and swell different resins, including our new product "eSolve 21FP-5," which has strong solubility for PET and PBT, as well as products for PA, PC, ABS, urethane, epoxy, and more. We invite you to visit our booth. Event Schedule: April 16 (Wed) - April 18 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 4 & 5 Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 Booth Number: 4-522 Exhibited Products: 1) Resin solvents suitable for mold cleaning 2) Resin solvents suitable for smoothing 3D printed objects 3) Low workload urethane nozzle cleaning agents 4) Cleaning agents suitable for degreasing press processing oils We look forward to your visit. Please register in advance using the link below.
-
Date and time Wednesday, Apr 16, 2025 ～ Friday, Apr 18, 2025
10:00 AM ～ 05:00 PM
- Capital Tokyo Big Sight, East Hall 4 & 5 〒135-0063 3-11-1 Ariake, Koto-ku, Tokyo
- Entry fee Charge 3,000 yen (including tax) *Free for those who have pre-registered and bring their visitor pass.