Epoxy resin solvent "eSolv 21HEK"
Dissolve hardened epoxy resin with 'eSolve 21HEK'! Suitable for maintenance (on circuit boards) as well! Even more effective with heating! No flash point!
The epoxy resin solvent and stripping agent 'eSolv 21HEK' swells, collapses, and separates cured (hardened) epoxy resin by immersion. Additionally, it has no flash point and is low in toxicity, making it easy to handle and contributing to reduced environmental impact. It does not contain chlorine-based solvents commonly found in other products! Past achievements include: - Dissolving and stripping epoxy resin on substrates - Opening encapsulants on substrates (for good product analysis and defective product analysis) - Removing epoxy resin for SEM observation - Opening power cards - Cleaning dispenser nozzles contaminated with two-component epoxy adhesives If you are having trouble with cleaning or dissolving epoxy, please feel free to contact us. [Features] ■ Not subject to the Organic Solvent Control Law, the Specific Chemical Substances Control Law, or the Fire Service Act ■ Low environmental impact and safe to work with ■ Non-flammable and non-water-soluble ■ Significantly reduces dissolution time ■ No chlorine-based solvents used! *For more details, please refer to the catalog. Feel free to contact us for inquiries or consultations!
basic information
【Product Lineup】 'eSolve 21HUK' For dissolving, swelling, and peeling of urethane resin before and after curing, and for dissolving polycarbonate resin. 'eSolve 21HEK' For dissolving, swelling, and peeling of epoxy resin after curing. 'eSolve 21RS' Solvent for solid silicone resin. 'eSolve 21RA-1' Adhesive and solvent for acrylic resin, and for peeling ABS, polycarbonate, and polyester resins. We also accept commissioned tests (for a fee) for the analysis of electrical and electronic components (such as circuit boards) using resin solvents. (Negotiable)
Price range
Delivery Time
Model number/Brand name
eSolve 21HEK
Applications/Examples of results
【Main Uses】 ◎ Dissolution and peeling of epoxy resin on substrates ◎ Opening of substrate sealants (good product analysis and defect analysis) ◎ Removal of epoxy for SEM observation ◎ Opening of power cards ◎ Cleaning of dispenser nozzles contaminated with two-component epoxy adhesives
Related Videos
Line up（1）
| Model number | overview |
|---|---|
| eSolve 21AM-1 | Dissolution of epoxy resin |
