Post-cured epoxy solvent "eSolv 21HEK" (non-flammable)
Domestic and international patent applications completed! A product that can be dissolved even after epoxy curing!
Traditionally, for the dissolution, swelling, and peeling of cured epoxy resins, cleaning agents with a significant environmental impact and even hazardous cleaning agents subject to fire safety laws have been widely used. Kaneko Chemical has developed eSolve 21HEK to address these issues. (Patents applied for both domestically and internationally)
basic information
- Specific gravity: approximately 1.15 (25℃) - Boiling point: approximately 120℃ - KB value: 130 or higher - Appearance: colorless and transparent - Does not contain chlorine-based cleaning agents - Not subject to organic regulations - Not subject to fire service law
Price range
Delivery Time
Model number/Brand name
eSolve 21HEK
Applications/Examples of results
Dissolution, swelling, peeling, and alternative to fuming nitric acid of solid material after curing of epoxy resin. *Please perform immersion cleaning, ultrasonic cleaning, and spray cleaning with the concentrated solution. Additionally, heating to around 30-50°C will enhance the treatment effect.
Line up（1）
| Model number | overview |
|---|---|
| eSolve 21AM-1 | Proven performance in dissolving epoxy resin |
catalog（2）
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At Kaneko Chemical, we have taken the lead in the industry by focusing on bromine and have developed the e-Clean 21 series of cleaning agents using normal-propyl bromide as a raw material through our unique technology. These products are widely used as alternatives to chlorine-based organic solvents for cleaning electronic components, metals, and resins. Furthermore, Kaneko Chemical is engaged in research and development of environmentally friendly chemical products, having developed and launched resin solvents and the next-generation fluorine-based organic solvent e-Clean 21F series, while providing high-quality products and technical services.