FLOIL Heat Dissipation Compound
Heat dissipation expert. Amazing heat dissipation effect! Protects electronic devices from heat.
In electronic devices, the generation of heat is unavoidable. Prolonged heat generation can accumulate significant damage to the electronic equipment. Kanto Kasei has developed a "thermal conductive compound" to protect such electronic devices from heat. Our thermal conductive compound is applied between the heat source and the heat sink, reducing thermal resistance and contributing to more efficient heat dissipation. 【Features】 ■ Being in compound form allows for thickness control ■ There is a significant difference in thermal resistance compared to thermal sheets, even with the same thermal conductivity ■ Can be applied with a dispenser ■ Unlike adhesives, it allows for rework, providing operational advantages *For more details, please feel free to contact us.
basic information
"Do you have any of these concerns?" ■ I want to address heat issues on the circuit board. → "Standard type (0.83w/m·k)" is recommended. ■ It's difficult to attach heat dissipation sheets. → "High thermal conductivity type (2.1w/m·k)" is recommended. * For more details, please feel free to contact us.
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Applications/Examples of results
【Usage】 ■Contact surface between IC and heat sink *For more details, please feel free to contact us.
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Our independently developed FLOIL(R), HANARL(R), and METAX(R) are used in various applications for high-tech electronic devices such as televisions, videos, cameras, computers, automobiles, and aircraft. The numerous products developed by our company, which always anticipates the demands of the times, have gained immense trust from the industrial sector.