Semiconductor Tape Adhesive Release Liquid "EZ(S)-Series"
NMP, DMSO, and TMAH free! We consider the health hazards to workers and the negative impact on the environment.
The "EZ(S)-Series" is a semiconductor tape adhesive remover that demonstrates excellent peelability and solubility for adhesive residues after tape removal. It offers high selectivity without damaging the contact materials (such as Cu and SiO2). Free from NMP, DMSO, and TMAH, it takes into consideration the health of workers and the environmental impact. It is suitable for the removal and dissolution of adhesive residues after dicing tape and back grind tape. 【Features】 ■ Excellent peelability and solubility for adhesive residues after tape removal ■ High selectivity without damaging contact materials (such as Cu and SiO2) ■ Free from NMP, DMSO, and TMAH *For more details, please download the PDF or feel free to contact us.
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EZ(S) Series
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We have aimed to be a unique manufacturer that not only meets cutting-edge standards but also develops and produces high-purity reagents that exceed those standards. Additionally, we have pioneered the establishment of specifications for ultra-high-purity chemicals used in semiconductor manufacturing processes, and we now hold a top share in functional chemicals that are essential to the global semiconductor industry.