Improved productivity with uniform cleaning without washing unevenness | Spray nozzle for cleaning electronic components
Achieve cost reduction and quality improvement with precision cleaning suitable two-fluid nozzles, optimized single-fluid nozzles for nozzle usage, and uniform slit nozzles.
The "VVP" series features a top-tier fluid fan-shaped nozzle that sprays in Yamagata, designed to achieve the most uniform flow distribution when arranged in multiple configurations. The "INVV" series also consists of Yamagata fan-shaped nozzles, allowing for the chip part of the nozzle to be easily attached and detached from the main body, enabling the worn chip to be replaced while the nozzle is still attached, thus reducing maintenance time. The "INJJX" series is a one-touch conical nozzle that sprays evenly in a circular pattern, making it suitable for standalone use. The "VVEA" series is a two-fluid fan-shaped nozzle that emits fine mist with an average particle diameter of 50μm or more, delivering strong impact and thickness, penetrating into fine details for precision cleaning. The "INVVEA" series features a one-touch header that reduces the time required for replacement. The "SLNH-H" series is a single-fluid slit nozzle that distributes a thin liquid curtain evenly, contributing to water and chemical cost savings. The "PSN" series is a two-fluid slit nozzle that sprays uniformly and without variation with high impact. *We also offer a wide range of other spray nozzles. For quotes, custom orders, or any concerns regarding nozzles, please feel free to contact us. Phone and online consultations are available at any time.*
basic information
The spray volume, dimensions, and other specifications vary by model number. For details, please check the PDF materials or feel free to contact us.
Price range
Delivery Time
Model number/Brand name
VVP INVV INJJX SLNH-H VVEA INVVEA PSN
Applications/Examples of results
1. Semiconductor manufacturing process Wafer cleaning Removal of residues and particles after resist coating and developing in the photolithography process Removal of residues after the film formation process 2. PCB (Printed Circuit Board) manufacturing Cleaning after etching Substrate cleaning before resist coating Removal of flux after assembly 3. Assembly and mounting process Cleaning before bonding Surface cleaning of the lead frame 4. Optical and display-related Cleaning of LCD panels and organic EL substrates Cleaning of optical components (lenses, mirrors)
