Hollow fiber membrane degassing module [external perfusion method, internal perfusion method]
By using hollow fiber membranes, it contributes to the increase of the liquid-gas interface and also achieves a reduction in the time required for degassing. Degassing can be done inline and in one pass.
Liquids that come into contact with air contain gases such as nitrogen and oxygen, which are components of air. The gases in such liquids can sometimes cause various problems, such as rusting in pipes. This phenomenon can be prevented by degassing in advance. The larger the surface area (interface) where the liquid and gas meet, the more efficient the degassing can be. By using hollow fiber membranes, it is possible to increase the interface between the liquid and gas, which can also shorten the time required for degassing.
basic information
- External perfusion method (EF series) This is a small degassing module using PMP resin for the degassing membrane in an external perfusion method. It can achieve degassing down to ppb levels and can minimize the generation of condensed water by using a degassing membrane with a skin layer. - Internal perfusion method (PF series) This is a degassing module using PMP resin for the degassing membrane in an internal perfusion method. It can minimize the generation of condensed water by using a degassing membrane with a skin layer. - Internal perfusion method (PF-F series) This is a degassing module with all wetted parts made of fluoropolymer resin, using a fluoropolymer resin for the degassing membrane. It is capable of degassing liquids such as acids, alkalis, and organic solvents.
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Delivery Time
Applications/Examples of results
- Degassing pure water for analytical devices to improve dispensing accuracy - Degassing and deoxygenating from pure water - Degassing and defoaming from surfactants and inkjet inks - Defoaming treatment for water used in ultrasonic cleaners - Degassing and defoaming of analytical reagents and solvents (various resists, solvents, reagents, etc.) - Degassing and defoaming of semiconductor reagents and solvents (various resists, solvents, reagents, etc.) - Degassing and defoaming of liquid crystal reagents and solvents (various resists, solvents, reagents, etc.)