*Explanation in the video! Grinding device Super Finisher Flat Grinding*
For polishing various substrates and for fine burr removal in punched areas.
Super Finisher flat surface grinding allows even beginners to subtly differentiate the use of laps on the back side of the stamper original plate, and the environment is clean. The stamper back surface grinding device polishes the back side of the stamper using a lapping film. The clamping and unclamping of the workpiece is done by the operator, while roll grinding, pad grinding, brush cleaning, and air blowing are performed automatically. The various surface roughness requirements from different companies can be processed under optimal conditions by selecting the appropriate lapping tape and changing the parameters of the device. *Features* 【Stamper Back Surface Grinding Device】 - Various surface roughness requirements from different companies can be processed under optimal conditions by selecting the appropriate lapping tape and changing the parameters of the device. - The circumference of the roll grinding can be randomized with pad grinding. - Once the conditions are set, even beginners can operate it easily. 【Thin Plate Flat Surface Grinding Device】 - The film width can be selected according to the workpiece (supports two types), achieving high efficiency and low-cost processing. - Effective for polishing various substrates and removing fine burrs from punched parts. - If a sub-table is provided, external setup can be done during processing time. *For more details, please download the materials or contact us.*
basic information
【Features】 [Stamper Back Surface Polishing Device] - Various surface roughness requirements from different companies can be met by selecting the appropriate lapping tape and adjusting the device's parameters, allowing for processing under optimal conditions. - The circumferential marks from roll polishing can be randomized using pad polishing. - Once the conditions are set, even beginners can operate it easily. [Thin Plate Flat Polishing Device] - The film width can be selected based on the workpiece (supports two types), achieving high efficiency and low-cost processing. - Effective for polishing various substrates and removing fine burrs from punched areas. - If a sub-table is provided, external setup can be performed during processing time. ● For more details, please contact us or refer to the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
【Applications】 ○ Polishing of thin film substrates ○ Flattening of multilayer substrates ○ Stampers ○ Optical discs ○ Magnetic discs ● For more details, please contact us or refer to the catalog.
