Grinding device Ultra-flatness device FCMP-II series
Maximizing the features of the wrapping tape makes the intended polishing easy.
As the performance and miniaturization of multilayer build-up substrates progress, increasingly stringent flattening processing is required. The FCMP-II series maximizes the characteristics of the wrapping tape, making it easy to achieve the desired polishing and simplifying equipment management. It enables polishing with minimal hole formation. By selecting the appropriate tape gauge, roughness management becomes easy, and it can be used for both wet and dry applications. Once set up, anyone can use it easily. For more details, please contact us or refer to the catalog.
basic information
**Features** [PCB Surface Polishing Device] ○ Easy management of roughness by selecting tape grit ○ Usable for both wet and dry applications ○ Once set up, anyone can use it easily **Specifications** ○ Workpiece dimensions that can be processed: Maximum 510mm × 510mm ○ Tape specifications → Tape width = 60mm → Maximum roll length = 100m → Core = 3 inches ○ Table speed: Maximum speed = 80mm/second ○ Control → Equipment = Sequencer → Control panel = Touch panel ○ Power supply: 200V, 3-phase ○ Air: Dry air = 0.4–0.5MPa ○ Device dimensions: 2400W × 1400D × 1900H (mm) ○ Device weight: Approximately 3000kg ● For more details, please contact us or refer to the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
【Applications】 ○ Polishing of protrusions in filler resin ○ Removal of excess resin and leveling of surface resin ○ Removal of metal oxide films, pastes, plating residues, and burrs ○ Pre-treatment polishing before plating/laminating/resist coating ● For more details, please contact us or refer to the catalog.
